RF4 RF-HD33 Professional CPU Degumming Knife
₨1,500
Professional CPU Degumming Knife
The RF4 RF-HD33 is a professional CPU degumming knife for removing aged black glue and PI underfill from CPUs, ICs and PCBs. Its 45° angled, ultra-thin PI blade slides under chips and clears residue without scratching pads or traces. The 110mm anti-slip handle and 20mm blade give you steady control around solder pads and densely packed components. Keep it on your repair bench for IC change karna jobs, BGA prep and mainboard cleaning on dead phone and hardware fault repairs. Order the RF-HD33 from RF4Tools Pakistan.
| Weight | 0.01 kg |
|---|
10 in stock
SKU:
RF-SD215
Categories: Other Tools, All Products
Tags: BGA cleaning tool, black glue remover, CPU degumming knife, CPU glue removal knife, IC glue scraper, mobile repair tools, PCB repair tools, PI underfill removal scraper, RF4 RF-HD33, rf4tools pakistan
Brand: RF4TOOLS
Description
Professional CPU Degumming Knife for Clean Underfill Removal
The RF4 RF-HD33 professional CPU degumming knife handles the step most technicians rush: clearing hardened black glue from around and under a CPU or IC. Leftover residue ruins reballing, lifts pads and wastes bench time. The RF-HD33 pairs a thin PI blade with a 110mm handle, so you scrape adhesive off without gouging the board. It belongs on every bench that does IC change karna, CPU rework or BGA cleaning.
Blade Design and PI Material
The blade uses imported PI material, a soft, flexible engineering plastic that stays gentle on IC surfaces. Metal scrapers slip, scar solder mask and tear pads. PI grips hardened adhesive without cutting into the board. The 20mm blade tapers thin enough to slide under CPU and IC edges. The 45° angle lets you push residue outward in a controlled stroke instead of dragging it across exposed pads. The tip resists high temperature and holds its shape, so you can keep working while the board is still warm from your hot air station. Scratch-resistant, heat-resistant and non-slip are the three traits that matter on a live repair bench, and the RF-HD33 covers all three.
Where the RF-HD33 Fits in Your Repair Workflow
Start with heat. Warm the board with your hot air station until the glue softens, then run the blade along the CPU or IC perimeter. Clear the edge first, slide the tip underneath, and push loose residue out. On a dead phone with a hardware fault, this step exposes the pads you need to inspect under a microscope. After IC change karna, pass the blade over the pads again to lift aged black adhesive before you reball with your reballing kit. A clean pad gives solder balls a flat seat and lowers the risk of shorts. Finish with a multimeter continuity check around the cleaned area and clamp the board in a PCB holder for steady work. The RF-HD33 also handles glue on BGA packages and hard drive PCBs, so one tool covers several bench jobs. Pair it with soldering stations and hot air stations from the RF4Tools range. Once the hardware side is clean, move on to ISP pinout tools or eMMC programmers.
Handle, Control and Daily Bench Use
The 110mm handle keeps your fingers well away from the heated board. The anti-slip grip holds the blade steady near dense components, and the ergonomic shape cuts hand fatigue across a full day of jobs. Short strokes with light pressure work best. Let the thin PI edge lift the glue instead of forcing it. Wipe residue off the tip between passes and replace the tool when the edge wears down. Service centers with high repair volume keep several on the bench so no technician waits for a free tool. If you handle boot loop issue or hang on logo repairs that end in CPU or eMMC rework, this professional CPU degumming knife prepares the board for the next step. Check our Reballing Kits, Microscopes and Test Boxes categories to build a complete rework setup around it.
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Q & A
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Key Features
- ✓Ultra-thin 45° angled blade for working under CPUs and ICs
- ✓Imported PI material, soft and safe on IC surfaces
- ✓Scratch-resistant degumming edge
- ✓High temperature resistance with stable shape
- ✓Non-slip ergonomic handle for precise control
- ✓110mm handle length for safe distance from heat
- ✓20mm blade length for deep reach under chips
- ✓Works on CPU, IC, PCB, BGA and hard drive glue
Specifications
| Brand | RF4 |
|---|---|
| Model | RF-HD33 |
| Category | CPU / PCB Glue Removal Tool (PI Underfill Removal Scraper) |
| Compatibility | CPU, IC, PCB, BGA and hard drive glue removal; universal, not device-specific |
| Material | PI |
| Dimensions | Handle 110mm, Blade 20mm |
Common Repair Uses
- ✓Removing aged black glue under CPUs
- ✓Cleaning PI underfill residue around ICs
- ✓Prepping pads before reballing
- ✓Cleaning pads after IC change karna
- ✓Clearing adhesive around solder pads
- ✓Cleaning BGA packages before reflow
- ✓Removing glue on hard drive PCBs
- ✓Clearing residue in tight component areas
Compatible Devices
- ✓Mobile phone mainboards with glued CPU packages
- ✓Mainboards with underfilled IC packages
- ✓BGA chips with aged black adhesive
- ✓PCB areas around solder pads
- ✓Densely packed component zones on phone boards
- ✓Hard drive PCBs with glue residue
- ✓Android phone boards from any brand (universal scope)
- ✓iPhone logic boards with glued ICs (universal scope)
FAQ
What is the product name?
The product name is RF4 RF-HD33 CPU Degumming Knife.
What is the brand of this product?
The brand of this product is RF4.
What is the model of this product?
The model of this product is RF-HD33.
What is this product used for?
This product is used for removing black glue and PI underfill from CPUs, ICs, BGA packages and PCBs.
Which devices are compatible with this product?
This product is compatible with CPU, IC, PCB, BGA and hard drive glue removal work. It is a universal tool and does not target specific phone models.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Can the RF-HD33 clean glue under a CPU without damaging pads?
Yes. The soft PI blade is thin enough to slide under chips and remove residual adhesive without damaging pads or traces. Use light pressure and short strokes under a microscope.
Can I use the RF-HD33 on a board heated by a hot air station?
Yes. The blade resists high temperature and keeps its shape under heat. Warm the board to soften the glue, then scrape with controlled strokes.








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