RF4 RF-KB11 3D Glue Remover Blade & Brush Set

₨1

IC Glue Remover Blade and Brush

The RF4 RF-KB11 pairs a stainless steel IC glue remover blade with an anti-static brush. You scrape hardened glue, resin and old tin off the board, then brush the area clean in the same job. It suits chip, CPU and IC positions on mobile boards. Use it after IC change karna, eMMC replacement or CPU removal, when dirty pads block a clean reball. The anti-static brush keeps the final clean-up safe for PCB work. One compact set covers the scrape-and-clean step on your repair bench, whether you fix a dead phone, a charging issue or a hang on logo board.

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Description

RF4 RF-KB11: IC Glue Remover Blade for Cleaner Board Work

The RF4 RF-KB11 is an IC glue remover blade with an anti-static brush in one set. You reach for it right after you lift a chip, when glue, resin and old tin still cover the pads. Dead phone jobs, charging issue repairs and IC change karna all end with the same requirement: a clean board. This set handles that step without a second trip to your tool drawer. On a busy Pakistani repair bench, one tool that scrapes and brushes saves minutes on every board.

Blade Work: Scraping Glue, Resin and Tin

The blade is stainless steel. It scrapes hardened glue and leftover tin from CPU, eMMC and other IC positions. Heat the area first with your hot air station, then work the edge in short, controlled strokes. Slow strokes protect the pads and the fine traces beside them. A rushed scrape lifts a pad, and a lifted pad turns a simple hardware fault into a jumper lagana job. Keep the blade flat and let the heat soften the glue before you push.

Anti-Static Brush: Final Clean Before Reflow

After scraping, sweep the area with the anti-static brush. It clears glue crumbs, flux residue and dust from between components. The anti-static build suits PCB work, where a charged bristle can harm a sensitive part. Clean pads give solder better contact when you reball or tin plant. Under a microscope you see the result at once: bright pads, no debris and no bridges waiting to cause a short.

Where It Fits in Your Repair Workflow

This set sits between chip removal and reballing. Lift the IC with your hot air station, scrape the pads with the blade, brush the area, then move to your reballing kit or soldering station. A PCB holder keeps the board steady while you scrape, so your hand stays free for control. After cleaning, check pad continuity with your multimeter before you place the new chip.

The same sequence applies to boot loop issue boards that need a new eMMC or CPU. It also covers dead after flash cases that trace back to storage faults. Technicians who run ISP or UFS work use it to prepare clean surfaces before they fit adapters or replacement chips.

Why Technicians Choose the RF-KB11

You get blade and brush in a single set, so your scrape-and-clean routine stays consistent from board to board. Stainless steel holds its edge through repeated scraping. The anti-static brush protects the board during the dust and residue clean-up that follows. Shops that handle daily volume of Samsung, Oppo, Vivo, Infinix and Tecno boards benefit from a tool that speeds up the slowest manual step. Pair it with a good hot air station and a microscope, and your pad prep reaches a professional standard every time.

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Q & A
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Key Features

  • Stainless steel blade for scraping glue and tin
  • Anti-static brush included in the same set
  • Double-ended design pairs scraping with cleaning
  • Suits chip, CPU and IC positions
  • Fits the gap between chip removal and reballing
  • Supports clean pad preparation
  • Works across iPhone, Samsung and Xiaomi boards
  • Compact set for daily bench use

Specifications

BrandRF4
ModelRF-KB11
CategoryMobile Repair Hand Tools – Glue Remover Blade Set
CompatibilityUniversal – not device-specific
Supported DevicesiPhone, Samsung, Xiaomi and other smartphones, tablets and precision electronics
MaterialStainless steel (blade)

Common Repair Uses

  • Glue removal around IC positions
  • Resin and underfill clean-up near CPU and eMMC
  • Old tin scraping from pads
  • Pad preparation before reballing
  • Pad preparation before tin planting
  • Flux residue removal after soldering
  • Dust and debris cleaning on PCBs
  • Board clean-up after IC change karna

Compatible Devices

  • iPhone logic boards
  • Samsung Galaxy boards
  • Xiaomi boards
  • Other Android phone boards
  • iPad boards
  • Tablet boards
  • Smartwatch boards
  • Laptop and MacBook boards

FAQ

What is the product name?
The product name is RF4 RF-KB11 3D Glue Remover Blade and Anti-Static Brush Set.
What is the brand of this product?
The brand of this product is RF4.
What is the model of this product?
The model of this product is RF-KB11.
What is this product used for?
This product is used for scraping glue, resin and old tin from mobile phone boards and cleaning the area with an anti-static brush.
Which devices are compatible with this product?
This is a universal board-level tool. Supplier listings mention suitability for iPhone, Samsung and Xiaomi boards, plus tablets and other precision electronics.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Can this blade remove glue from CPU and eMMC chip positions?
Yes. The blade scrapes glue and tin around chip, CPU and IC positions. Heat the area with a hot air station first, then scrape with light, flat strokes to protect the pads.
Do I need to clean the board after scraping with the blade?
Yes. Brush the area with the included anti-static brush to clear glue crumbs and flux residue before you reball, tin plant or place a new chip.