RF4 RF-HP02 Microchip Removal Station

₨950

RF4 RF-HP02 Glue Removal Station

The RF4 RF-HP02 chip heating glue removal station gives your bench a dedicated platform for softening glue around BGA ICs on phone motherboards and FPC assemblies. It features an adjustable screw design and targets the slow, messy part of chip work: glue cleanup. Use it during phone disassembly, board cleaning, and IC change karna jobs. It sits beside your hot air station and soldering station as a prep tool, not a replacement for either. RF4Tools Pakistan lists the RF-HP02 for technicians and repair shops that clean glue off boards every day.

Weight0.02 kg

10 in stock

Description

Chip Heating Glue Removal Station for Phone Motherboard Repair

The RF4 RF-HP02 is a chip heating glue removal station for phone motherboard work. If you pull BGA ICs daily, you know glue under and around the chip slows every job. This station handles that step. It gives you a heating platform with an adjustable screw, built for BGA IC cleaning on motherboards and FPC during phone disassembly.

Where the RF-HP02 Fits in Your Repair Workflow

Every chip job follows the same order. You open the phone, find the hardware fault, soften the glue, lift or clean the chip area, then rebuild and test. The RF-HP02 covers the glue step. A dead phone, a charging issue, or a display problem often ends with an IC change. Glue around that IC stands between you and a clean pad area.

Pair it with the tools around it. A hot air station handles chip removal. A soldering station cleans pads. A microscope lets you check the pads, and a PCB holder keeps the board steady. Reballing kits finish the job before you test with a multimeter. The RF-HP02 slots into that chain at the prep stage, so your other tools work on a board that is ready for them.

Key Features Technicians Check First

Start with the platform. The listing for the RF-HP02 describes a chip heating glue removal station, so the job is clear: soften glue, then clean it. The adjustable screw is the second feature to note. It gives the station a mechanical adjustment point that a flat, fixed plate does not offer.

The RF-HP02 targets BGA IC cleaning on phone motherboards. It also covers FPC work and phone disassembly. That scope keeps it simple. It does not replace a hot air gun, a reballing stencil set, or a microscope. It handles one stage of the job, and you keep your other tools for the rest.

Confirm the listed scope against your own bench needs before you buy. The RF-HP02 suits board-level glue work on phones. It is not a machine for large PCBs or non-phone electronics.

Who Should Buy the RF4 RF-HP02

Bench technicians who clean glue off boards several times a day gain the most. Repair shop owners who train new staff on chip work gain too, because a dedicated glue station gives beginners a safe, repeatable prep step. Service centers that handle volume gain by splitting prep from rework, so one tool does not hold up the whole bench.

If you run a basic bench today, the RF-HP02 is a low-complexity upgrade. You keep your current hot air and soldering setup and add a prep stage in front of it. As your workload grows, you can move up to preheating platforms, advanced rework stations, and ISP or eMMC tools for deeper board-level repair. Browse the RF4Tools Pakistan catalog for hot air stations, soldering stations, microscopes, reballing kits, PCB holders, and multimeters to build out the full chain.

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Q & A
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Key Features

  • Chip heating glue removal station
  • Adjustable screw design
  • BGA IC cleaning function
  • Suited to FPC and phone motherboard work
  • Supports phone repair disassembly

Specifications

BrandRF4
ModelRF-HP02
CategoryRepair Platform / Chip Heating Glue Removal Station
CompatibilityMobile phone motherboards, FPC assemblies, BGA ICs (universal, not device-specific)

Common Repair Uses

  • BGA IC glue removal and cleaning
  • Motherboard chip-area cleaning
  • FPC glue removal
  • Phone disassembly prep
  • Pre-rework glue softening before IC change karna

Compatible Devices

  • Mobile phone motherboards
  • FPC (flexible printed circuit) assemblies
  • BGA IC areas on phone boards
  • Boards from any phone brand that needs chip-area glue cleaning

FAQ

What is the product name?
The product name is RF4 RF-HP02 Microchip Removal Station.
What is the brand of this product?
The brand of this product is RF4.
What is the model of this product?
The model of this product is RF-HP02.
What is this product used for?
This product is used for heating and removing glue around BGA ICs on phone motherboards and FPC during repair and disassembly.
Which devices are compatible with this product?
This product is compatible with mobile phone motherboards and FPC assemblies. It is universal and not tied to specific phone models.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Does the RF-HP02 replace a hot air station for chip removal?
No. The RF-HP02 is a chip heating glue removal station for glue softening and BGA IC cleaning. You still need a hot air station and soldering station for chip removal and pad work.
Is the RF-HP02 for specific phone brands like Samsung or Oppo, or is it universal?
The RF-HP02 targets phone motherboard and FPC glue removal in general. The listing does not tie it to specific brands or models.