RF4 R2015 Low Residue Desoldering Wick 1.5M (10 Pcs)

₨3,200

Low Residue Desoldering Wick R2015

The RF4 R2015 is a low residue desoldering wick with a 2.0 mm pure copper braid, 1.5 m long. Each pack holds 10 pieces, so your bench never runs dry mid-job. The braid pulls old tin off phone motherboard pads, BGA footprints, QFP leads and 0201 areas without extra flux. You level pads after an IC change karna, clear solder bridges, and prep boards for reballing. The soft braid bends around shield frames and connectors. Pair it with your soldering station or hot air station and finish clean joints faster.

Weight0.25 kg

10 in stock

Description

Low Residue Desoldering Wick for Clean Phone Board Rework

The RF4 R2015 is a low residue desoldering wick built for phone board rework. It carries a 2.0 mm pure copper braid, 1.5 m long, and the pack gives you 10 pieces. If you handle dead phone boards, charging issue repairs and BGA cleanup every day, you burn through wick quickly. A bulk pack keeps your repair bench stocked and your workflow steady.

Braid Design and Heat Transfer

RF4 braids high-purity copper into a flat, flexible strand. Copper conducts heat fast, so the wick draws solder into the braid before the pad overheats. That matters on thin phone PCBs, where long dwell time lifts pads and tears traces. The braid stays soft, so you can bend it around shielding frames and press it into tight corners beside connectors.

Low Residue Chemistry

The wick carries a low residue treatment. According to the product specification, it absorbs solder without extra flux, which cuts your cleanup afterwards. You still wipe the area with IPA before inspection, but you spend less time scrubbing sticky flux off fine pads. The treatment also resists oxidation and corrosion, so spare pieces keep working after weeks in your drawer.

Where R2015 Fits in Your Repair Workflow

You reach for this wick at three points in a board repair. After you lift a failed IC with a hot air station, you drag the wick across the pads and level the leftover tin. Before reballing, you clean every pad so the stencil sits flat and the new balls seat evenly. During jumper lagana work, you pull solder bridges and excess tin off test points and fine traces.

The specification lists suitability for phone motherboards, BGA, QFP and 0201 precision PCBs. That covers most hardware fault jobs on a technician’s bench, from boot loop issue boards with damaged pads to display problem repairs on flex connector footprints.

2.0 mm Width: When to Choose R2015

RF4 sells this wick in two widths: R1515 at 1.5 mm and R2015 at 2.0 mm. The 2.0 mm braid covers wider pad rows and large BGA pad fields in fewer passes. It also holds more solder per section, so you cut and replace less often. Choose the 1.5 mm version when you work inside tight pad clusters. Many technicians keep both widths on the bench.

Why Technicians Stock the 10-Piece Pack

Repair shops and service centers use wick every day. A saturated braid stops absorbing, so you snip off the used section with nippers and keep going. Ten pieces mean you restock once instead of reordering mid-week. Set the wick next to your soldering station, microscope, PCB holder and reballing kit, and you cover the full pad-cleaning step of every IC-level repair.

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Q & A
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Key Features

  • 2.0 mm wide braid for wider pad rows
  • 1.5 m length per piece
  • High-purity pure copper braid with fast heat transfer
  • Strong capillary absorption for quick solder removal
  • Low residue treatment, no extra flux needed per specification
  • Anti-oxidation and corrosion resistance for stable storage
  • Soft, flexible braid that reaches narrow joints
  • 10-piece pack for daily workshop use

Specifications

BrandRF4
ModelR2015
CategoryDesoldering Wick / Solder Braid
CompatibilityMobile phone motherboards, BGA, QFP and 0201 precision PCBs
TechnologyLow-residue treated, anti-oxidation braided copper
MaterialHigh-purity pure copper braid
DimensionsWidth 2.0 mm, Length 1.5 m per piece
Pack Quantity10 pieces

Common Repair Uses

  • Leveling pads after IC removal (IC change karna)
  • Cleaning BGA pads before reballing
  • Removing solder bridges (jumper lagana)
  • Cleaning charging port pads on charging issue boards
  • Removing excess tin from QFP leads
  • Pad cleanup on boards with a hardware fault
  • Cleaning flex connector pads on display problem boards
  • General PCB rework and tin cleaning

Compatible Devices

  • Mobile phone motherboards (all brands, universal use)
  • BGA IC pad fields
  • QFP IC lead pads
  • 0201 precision PCB areas
  • Charging port solder pads
  • Flex connector footprints
  • Eight-pin and larger IC pad rows
  • General SMD and PCB rework boards

FAQ

What is the product name?
The product name is RF4 R2015 Low Residue Desoldering Wick 1.5M (10 Pcs).
What is the brand of this product?
The brand of this product is RF4.
What is the model of this product?
The model of this product is R2015.
What is this product used for?
This product removes solder from phone motherboards and precision PCBs, and cleans BGA, QFP and 0201 pads.
Which devices are compatible with this product?
This product suits phone motherboards, BGA, QFP and 0201 precision PCBs. It works as a universal consumable and does not tie to specific phone models.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
What is the difference between RF4 R1515 and R2015 desoldering wick?
R1515 measures 1.5 mm wide and R2015 measures 2.0 mm wide. Both are 1.5 m long. R2015 covers wider pad areas in fewer passes.
Do I need to add flux when using the R2015 desoldering wick?
The product specification states the low residue treatment absorbs solder without additional flux.