RF4 RF-H3 Professional Digital Hot Air Gun 1200W

₨35,000

Professional Digital Hot Air Gun for Rework

The RF4 RF-H3 professional digital hot air gun gives your repair bench 1200W of controlled heat. You dial in 100–480°C, set airflow from 5% to 100%, and save your favourite profiles in four memory modes. A high-speed turbofan moves 50 litres of air per minute, and the digital display shows your working values while you reflow. Five nozzle sizes from 4 mm to 11 mm let you target small ICs, eMMC, UFS and CPU packages. Use it for IC change karna, BGA reballing, shield removal and dead phone board repair.

Weight3.5 kg

10 in stock

Description

RF4 RF-H3 Professional Digital Hot Air Gun for BGA and IC Rework

The RF4 RF-H3 is a professional digital hot air gun that targets the heat-sensitive work on your repair bench. It delivers 1200W, a 100–480°C temperature range and airflow you adjust from 5% to 100%. You set the numbers on the digital display, store them in one of four memory modes, and recall the same profile on the next board. If you handle IC change karna, BGA reballing or shield removal every day, this station gives you repeatable heat instead of guesswork.

Temperature and Airflow Control

The RF-H3 covers 100°C to 480°C. That span reaches both leaded and lead-free solder and leaves headroom for shield cans and boards with large ground planes. Airflow runs from 5% to 100%, and the station moves 50 litres per minute at full output. A high-speed turbofan spinning at 15000 rpm drives that flow.

Low airflow protects tiny passives and neighbouring capacitors, so you can work beside a flex connector without blowing parts off their pads. High airflow pushes heat into a large BGA package quickly and shortens the time the board sits under heat. Raise temperature and cut airflow when you need gentle, even heating around plastic connectors. Drop temperature and raise airflow when you want to spread heat across a big board without scorching one corner. The digital display shows both values, so you track them at a glance while you work.

Four Memory Modes for Repeat Jobs

The RF-H3 stores four working modes, and each mode holds its own temperature and airflow pair. Assign one to small SMD parts, one to eMMC or UFS removal, one to CPU reballing and one to shield cans. Recall the profile with a single press and start the job.

A busy workshop gains real minutes from this. Every technician on the bench uses the same proven settings, so a junior technician does not guess at numbers on a customer’s board. The revised front panel puts the four presets within easy reach, and the newer stand keeps the handpiece at hand between jobs. You stop adjusting dials on every repair and spend that time on the repair itself.

Nozzle Range for Different Package Sizes

The RF-H3 supports five nozzle sizes: 4 mm, 5 mm, 7 mm, 9 mm and 11 mm. Match the nozzle to the component. The 4 mm and 5 mm sizes typically suit charging ICs, small connectors and compact power parts. The 7 mm and 9 mm sizes fit mid-size packages. The 11 mm nozzle covers wider chips such as eMMC, UFS and CPU packages, where you need broad, even heat coverage.

A tight nozzle match concentrates heat on the target and keeps neighbouring parts cooler. Protect nearby plastic and sensitive parts with heat-resistant tape, hold the nozzle steady above the chip, and keep the air moving in small circles instead of parking it on one corner.

Where It Fits in Your Repair Workflow

Hot air sits at the centre of hardware repair. You diagnose a dead phone with a multimeter and a power supply, trace the fault to a failed IC, and lift that IC with the hot air gun. Then you clean the pads, apply flux, place the new part and reflow it.

Many charging issue, hang on logo and boot loop issue cases come down to a hardware fault on the board. Software marna does not fix those, and rework does. A dead after flash phone can also trace back to a damaged eMMC. Hot air lets you lift the chip, test it, reball it and refit it.

Pair the RF-H3 with a microscope to inspect pads and a PCB holder to keep the board steady. Add a reballing kit for BGA work and a soldering station for fine pad cleanup after removal. If your bench also runs ISP pinout tools, eMMC programmers, UFS adapters or test boxes, the hot air gun covers the physical side of that same workflow. You lift the chip, read or program it, then reball and refit it.

Where the RF-H3 Sits in the RF4 Hot Air Range

The RF-H3 moves you above the entry-level RF-H2 with four memory modes, a revised front panel and a new stand. The RF-H4 shares the same core specifications and adds a one-click cold air pedal. If your work stays mostly at the bench with stored profiles, the RF-H3 covers it. If you want hands-free cooling, the RF-H4 is the next step up.

RF4 Tools Pakistan lists the RF-H3 for repair shops, service centers and training institutes that need a dependable professional digital hot air gun for daily IC, eMMC and CPU rework.

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Q & A
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Key Features

  • 1200W power for fast heat-up
  • 100–480°C temperature range
  • Airflow adjustable from 5% to 100%
  • 50 L/min air volume
  • High-speed 15000 rpm turbofan
  • 4 memory working modes for stored profiles
  • Five supported nozzle sizes (4/5/7/9/11 mm)
  • Digital display for temperature and airflow values

Specifications

BrandRF4
ModelRF-H3
CategoryHot Air Gun / Hot Air Rework Station
TechnologyHigh-speed turbofan with digital display and 4 memory working modes
Power Rating1200W
Temperature Range100–480°C
Airflow Adjustment5%–100%
Air Volume50 L/min
Fan Speed15000 rpm
Nozzle Sizes Supported4 mm, 5 mm, 7 mm, 9 mm, 11 mm

Common Repair Uses

  • IC change karna on dead phone boards
  • Charging IC and PMIC removal and replacement
  • eMMC and UFS chip removal for reballing
  • CPU and BGA reballing preparation
  • Shield can removal
  • Flex and board-to-board connector rework
  • Desoldering SMD components
  • Board preheating before pad work

Compatible Devices

  • Samsung Android motherboards
  • Oppo and Realme motherboards
  • Vivo motherboards
  • Infinix and Tecno motherboards
  • Xiaomi and Redmi motherboards
  • iPhone logic boards
  • Tablet and laptop PCBs with SMD components
  • eMMC, UFS, CPU and BGA chip packages

FAQ

What is the product name?
The product name is RF4 RF-H3 Digital Hot Air Gun.
What is the brand of this product?
The brand of this product is RF4.
What is the model of this product?
The model of this product is RF-H3.
What is this product used for?
This product is used for IC removal, BGA reballing, shield removal and SMD rework on mobile phone boards.
Which devices are compatible with this product?
This product is universal and not device-specific. It works on any board whose components fall within its 100–480°C range and supported nozzle sizes.
Who should use this product?
This product is suitable for mobile repair technicians, repair shops, service centers, and professional users.
Can the RF4 RF-H3 handle lead-free solder?
Yes. Its 100–480°C temperature range covers the melting range of common lead-free solder alloys, which sits roughly between 217°C and 227°C.
How many memory modes does the RF-H3 have, and which nozzle sizes does it support?
It stores 4 working modes, each with its own temperature and airflow setting. It supports five nozzle sizes: 4 mm, 5 mm, 7 mm, 9 mm and 11 mm.